Волфрам-медна сплав и молибден-медна сплав
are two alloys commonly used in the aerospace and electronics industries. Tungsten-copper alloy is a combination of tungsten and copper, which is known for its high thermal and electrical conductivity, high strength, and low thermal expansion. Molybdenum-copper alloy, on the other hand, is a combination of molybdenum and copper, which is known for its high strength, high electrical and thermal conductivity, and low coefficient of thermal expansion. Both alloys are used in applications such as heat sinks, connectors, and high-temperature components, where their properties are beneficial.
What is the difference between tungsten-copper alloy and molybdenum-copper alloy?
Also as alloy materials, tungsten copper alloy and molybdenum copper alloy have a very wide range of uses, such as used in aerospace, aviation, navigation, military, national defense, electronics, electric power, metallurgy, machinery, sports equipment and other industries. In the same application field, although they can be replaced in some cases, but there are many differences. Now, let's understand the difference between tungsten-copper alloy and molybdenum-copper alloy.
First, different definitions
Tungsten-copper alloy is an alloy material composed of tungsten and copper atoms, copper tungsten or tungsten copper with 10% ~ 50% copper content and 30% ~ 95% tungsten content Molybdenum-copper alloy is an alloy material composed of molybdenum and copper atoms. molybdenum-copper alloy is used in place of tungsten-copper alloy in many cases. According to the different chemical composition, molybdenum copper alloy brand can be divided into MoCu10, MoCu15, MoCu20, MoCu25, MoCu40, their total impurity content is less than 0.1%.
Two, the nature is different
Tungsten-copper alloy has the characteristics of both tungsten and copper, with good electrical and thermal conductivity, corrosion resistance, wear resistance and machining properties, etc., at 3000℃ above, the copper in the alloy will be liquefied and evaporated. Compared with tungsten copper, molybdenum copper has lower density and lighter weight, which is more suitable for some products with strict requirements on weight Pointers.
Molybdenum-copper alloy has the characteristics of both molybdenum and copper, and has the characteristics of non-magnetism, strong resistance to high temperature, high thermal conductivity, low adjustable coefficient of thermal expansion, excellent vacuum performance and mechanical workability. Molybdenum-copper is worse than tungsten-copper in heat resistance and wettability.
Three, the production process is different
The preparation methods of tungsten-copper alloy include powder metallurgy method, injection molding method, copper oxide powder method, tungsten skeleton penetration method, etc. Among them, the process flow of powder metallurgy to make tungsten-copper alloy is pulverizing - mixing - pressing - sintering and dissolving - cold processing.
The preparation methods of molybdenum-copper alloy include liquid phase sintering method and molybdenum skeleton fusion method. Liquid phase sintering method refers to the liquid phase sintering of molybdenum-copper powder after pressing and forming at the temperature of 1300-1500°C.
Four, different uses
Tungsten copper alloy is mainly used in high temperature resistant materials, electromachining electrodes, microelectronics materials, electrical alloys for high voltage switches, etc.
Molybdenum-copper alloy is suitable for the manufacture of military and civilian high power microelectronic devices.
Tungsten-copper alloy combines the advantages of tungsten and copper, among which tungsten has a high melting point (3410℃ for tungsten and 1080℃ for copper) and a high density (19.34g/cm3 for tungsten and 8.89 g/cm3 for copper). Copper has excellent conductivity and thermal conductivity, and tungston-copper alloy (the general composition range is WCu7~WCu50) has uniform microstructure, high temperature resistance, high strength, arc ablation resistance and high density. Moderate electrical and thermal conductivity, widely used in military high temperature resistant materials, high voltage switch electrical alloy, electromachining electrode, microelectronics materials, as parts and components are widely used in aerospace, aviation, electronics, electric power, metallurgy, machinery, sports equipment and other industries.
I. High temperature resistant materials for military use
Tungsten copper alloy is used in aerospace as nozzle, gas rudder, air rudder and nose cone of missile and rocket engine. The main requirements are high temperature resistance (3000K~5000K) and high temperature airflow erosion resistance. The main use of copper volatilization at high temperature formed by sweating refrigeration (copper melting point 1083℃) to reduce the surface temperature of tungsten copper. It is guaranteed to be used under extreme conditions of high temperature.
Two, high voltage switch with electrical alloy
Tungsten copper alloy in the high voltage switch 128kV SF6 circuit breaker WCu/CuCr, and high pressure vacuum load switch (12kV 40.5KV 1000A), lightning arrester has been widely used, high pressure vacuum switch small size, easy to maintain, wide range of use, can be used in wet, flammable and corrosive environment. The main performance requirements are arc ablation resistance, welding resistance, small cutoff current, less gas content, low thermal electron emission capacity. In addition to the conventional macro performance requirements, but also require porosity, microstructure properties, so to take special technology, vacuum degassing, vacuum fusion and other complex processes.
Three, electromachining electrode
In the early stage of EDM electrode, copper or graphite electrode was used, which was cheap but not ablative, and has been replaced by tungsten-copper electrode. Tungsten-copper electrode has the advantages of high temperature resistance, high temperature strength, arc ablation resistance, good conductivity and heat dissipation. The applications are focused on spark electrode, resistance welding electrode and high voltage discharge tube electrode.
Electromachining electrode is characterized by a wide variety of specifications, small batch and large amount. The tungsten-copper materials used as electromachining electrodes should have as high density and uniformity of microstructure as possible, especially the slender rod, tube and deformed electrodes.
4. Microelectronics materials
Tungsten-copper electronic packaging and heat-sink materials have not only the low expansion characteristics of tungsten, but also the high thermal conductivity characteristics of copper. Its thermal expansion coefficient and thermal conductivity can be changed by adjusting the composition of tungsten-copper, thus providing a wider range of application for tungsten-copper. Tungsten-copper materials are widely used in semiconductor materials because of their high heat resistance and good thermal conductivity, and their thermal expansion coefficient matching that of silicon wafers, gallium arsenide and ceramic materials. Suitable for high power device packaging materials, heat sink materials, heat dissipating components, ceramics and gallium arsenide base.
Fold edit this section material properties
Tungsten-copper alloy combines the advantages of copper and tungsten, such as high strength, high specific gravity, high temperature resistance, arc ablation resistance, good electric conductivity and processing performance. Using high quality tungsten powder and oxygen free copper powder, the application of isostatic molding (high temperature sintering - copper infiltration), to ensure product purity and accurate ratio, fine structure, excellent performance. Good arc breaking performance, good electrical conductivity, good thermal conductivity, small thermal expansion.
Fold and edit this category
Since the two metals are not insoluble, the tungsten-copper alloy has the low expansion, wear resistance, corrosion resistance of tungsten and the high electrical and thermal conductivity of copper, and is suitable for all kinds of mechanical processing. The tungsten-copper alloy can be processed according to the user's requirements for the production and size of tungsten-copper ratio. Tungsten-copper alloy generally uses the process of powder metallurgy: powder preparation - mixing - pressing and forming - sintering and leaching.
Folding tungsten-copper electrode
Welding electrode
Tungsten-copper alloy has high temperature resistance, arc ablation resistance, high specific gravity and high conductivity and thermal conductivity, and is easy to be machined for use in welding electrodes.
Fold tungsten-copper alloy rods
Tungsten copper is a composite material made of high purity tungsten powder with excellent metal characteristics and high purity copper powder with advantages such as plasticity and high conductivity. It is refined by the process of static pressing, high temperature sintering and copper melting. Good arc breaking performance, good conduction, small thermal expansion, high temperature does not soften, high strength, high density, high hardness.
Folding tungsten-copper electronic package
Tungsten-copper electronic packaging material: it has both low expansion characteristics of tungsten and high thermal conductivity characteristics of copper. Its thermal expansion coefficient and electrical conductivity can be changed by adjusting the composition of the material, thus providing convenience for the use of materials.
Folding tungsten-copper tube
Tungsten-copper alloy tubes are widely used in hard alloys and insoluble metals. Because tungsten-copper alloy is easy to machining, the use of tungsten-copper tube plays a great role in the case that the surface needs to be easy to machining and the inner diameter is small.
Molybdenum-copper alloy is used as a heat sink material because of its high thermal conductivity. The properties of these two alloys are similar, and the density of molybdenum-copper alloy is less than that of tungsten-copper alloy. The preparation of molybdenum copper alloy is mainly by melting method, using high quality molybdenum powder and oxygen free copper powder, the application of isostatic pressing molding (high temperature sintering - copper infiltration), fine structure, good arc breaking performance, good electrical conductivity, good thermal conductivity, small thermal expansion.
Manufacturing method
Liquid phase sintering method: tungsten copper or molybdenum copper powder after pressing forming, at 1300-1500° liquid phase sintering. The uniformity of the materials prepared by this method is not good, there are many gaps closed, the density is usually less than 98%, but by adding a small amount of nickel activated sintering, mechanical alloying or oxide reduction method to prepare ultrafine and nano powder can improve the sintering activity, so as to improve the density of tungsten-copper, molybdenum-copper alloys. However, the conductive and thermal properties of the material are significantly reduced by nickel activation sintering, and the conductivity of the material is also reduced by the introduction of impurities in mechanical alloying. It is difficult to produce powder by oxide co-reduction method because of its complicated process and low production efficiency.
Tungsten and molybdenum skeleton penetration method: tungsten powder or molybdenum powder is pressed into shape, and sintered into tungsten and molybdenum skeleton with certain porosity, and then copper penetration. This method is suitable for tungsten copper, molybdenum copper products with low copper content. Compared with molybdenum-copper, tungsten-copper has the advantages of smaller mass, easier processing, linear expansion coefficient, thermal conductivity and some major mechanical properties. Although the heat resistance is not as good as tungsten copper, but better than some heat resistant materials, so the application prospect is good. Due to the poor wettability of molybdenum-copper than tungston-copper, especially in the preparation of molybdenum-copper with low copper content, the density of the material after melting is low, resulting in the material's air tightness, electrical conductivity and thermal conductivity can not meet the requirements, and its application is limited.
Molybdenum-copper application
This specification is applicable to molybdenum-copper alloy rods used in the manufacture of military high-power microelectronic devices as heat sink sealing materials and aluminum oxide ceramic sealing and structural materials, and also applicable to the manufacture of high thermal conductance expansion sealing heat sink molybdenum-copper alloy rods used in the manufacture of civil high-power microelectronic devices.
Correlation characteristic
Molybdenum-copper alloy combines the advantages of copper and molybdenum, high strength, high specific gravity, high temperature resistance, arc ablation resistance, electric conductivity and good processing performance. The use of high quality molybdenum powder and oxygen free copper powder, the application of isostatic molding (high temperature sintering - copper infiltration), to ensure product purity and accurate ratio, fine structure, excellent performance. Good arc breaking performance, good electrical conductivity, good thermal conductivity, small thermal expansion.
